electric machine

SE611

    model:SE611

    color:black

    specification:50ml,1kg,6kg

    peculiarity:
    80℃ fast curing, low shrinkage, high bonding strength, suitable for a variety of processes. It has good adhesion to many materials.
    Cure at 90℃ for 15 minutes.
    Cure at 80℃ for 30 minutes.

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SE611 Low temperature curing epoxy adhesive is a solvent-free single component epoxy adhesive, which can cure quickly at 80 ° C, low shrinkage rate, high bonding strength, suitable for a variety of processes. It has good adhesion to many materials.


1. Main uses


1. Brushless motor motor lead fixed, LED backlight beads, components, household handheld appliances, etc.;


2. Industrial electronic appliances can not be cured at high temperature, and need curing applications within 100 degrees.




Second, product characteristics


1.80℃ fast curing, low shrinkage;


2. Good toughness, insulation, high bonding strength;


3. Good resistance to high and low temperature impact;


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