SE611

SE611 Low temperature curing epoxy adhesive is a solvent-free single component epoxy adhesive, which can cure quickly at 80 ° C, low shrinkage rate, high bonding strength, suitable for a variety of processes. It has good adhesion to many materials.

1. Main uses

1. Brushless motor motor lead fixed, LED backlight beads, components, household handheld appliances, etc.;

2. Industrial electronic appliances can not be cured at high temperature, and need curing applications within 100 degrees.

Second, product characteristics

1.80℃ fast curing, low shrinkage;

2. Good toughness, insulation, high bonding strength;

3. Good resistance to high and low temperature impact;