SE624

SE624 is a heat-curing epoxy resin adhesive suitable for bonding various materials such as ABS, PC, metal and ceramics.

1. Main uses

1. The bond between the motor fan and the rotary pump and the fixing of the motor commutator coil.

Second, product characteristics

1. Fast curing, 150℃ curing for 40min; Electromagnetic curing 200℃ 40-60s;

2. Impact resistance, high bonding strength, good heat resistance;

3. Thixotropy, no flow, conducive to gluing;